Abstract
A silver conductive thick film with a frit was examined for its potential applications in the plasma display panel industry. A low melting glass frit (firing temperature, less than 600 °C) was used in the conductive thick film for this work. The thermal behavior of the silver, frit and mixing powder was studied using hot stage microscopy. During the sintering of the silver conductive thick film with the frit, the frit melted, which was followed by accelerated densification. However, the increase in spreading rate with frit affected the microstructure, which has 1.9% porosity and the geometry of the silver conductive thick film. These results suggest that the content of the frit, firing temperature and the thermal properties of the frit in the silver conductive thick film influence the level of shrinkage, conductivity, and shape of the thick film.
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