Abstract
This paper presents a single-chip 3D electric field microsensor, in which a sensing element is set at the center to detect the Z-axis component of an electrostatic field. Two pairs of sensing elements with the same structure are arranged in a cross-like configuration to measure the X- and Y-axis electrostatic field components. An in-plane rotary mechanism is used in the microsensor to detect the X-, Y-, and Z-axis electrostatic field components simultaneously. The proposed microsensor is compact and presents high integration. The microsensor is fabricated through a MetalMUMPS process. Experimental results show that in the range of 0–50 kV/m, the linearity errors of the microsensor are within 5.5%, and the total measurement errors of the three electrostatic field components are less than 14.04%.
Highlights
Electrostatic field measurement is crucial in many industrial and scientific areas, such as high voltage direct current (HVDC) power system monitoring [1], lightning hazard warning [2,3], and space plasma studies [4,5]
Various sensors that can measure electrostatic fields have been developed, and most of them can be classified into four categories, namely, double probes [6], field mills [1,7], optical sensors [8,9,10], and micromachined electric field sensors (MEFSs)
Double probes and field mills are fabricated through traditional machining methods; as a result, they possess large volumes and complex structures and entail high power costs
Summary
Electrostatic field measurement is crucial in many industrial and scientific areas, such as high voltage direct current (HVDC) power system monitoring [1], lightning hazard warning [2,3], and space plasma studies [4,5]. By deriving a coupling sensitivity matrix, Wen et al [23] and Fang et al [24] distributed three 1D MEFSs in-plane and orthogonally to measure a 3D electrostatic field In their studies, the elimination of coupling interference among the three components of the electrostatic field relied on an algorithm instead of the structural design. The elimination of coupling interference among the three components of the electrostatic field relied on an algorithm instead of the structural design Their proposed devices are larger than single-chip MEFSs, their methods can be implemented and are minimally restrictive. To address the need for 3D electrostatic field measurement, this study proposes a single-chip 3D electric field microsensor, in which three orthogonal sensing axes are.
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