Single‐phase photo‐cross‐linkable adhesive synthesized from methacrylic acid‐grafted 1‐decene/9‐decene‐1‐ol cooligomer

Abstract

AbstractThe cooligomerization of 1‐decene with 9‐decene‐1‐ol was conducted by using a Ti amine bis‐phenolate catalyst. Light‐curable adhesive was prepared by the reaction of methacryloyl chloride with the hydroxyl groups of the synthesized cooligomer, which led to the introduction of photo‐polymerizable CC double bonds into the cooligomer chains. Comonomer insertion into 1‐decene oligomeic chains and also methacryloyl chloride reaction with cooligomer were confirmed by both FT‐IR and NMR spectroscopy. Three‐point bending analysis results of cured adhesive sample (cured with blue light) showed flexural modulus and flexural strength values of 1.41 GPa and 1.66 MPa, respectively. Maximum weight loss temperature of 444°C showed high thermal stability of cured adhesive sample. In order to explore adhesion abilities of the synthesized adhesive to different substrates including polymethylmethacrylate (PMMA), polycarbonate (PC), polystyrene (PS), nylon and aluminum (Al), tensile shear bond strength, and peeling tests were conducted. Synthesized adhesive demonstrated tensile shear strength values of 1.28, 1.95, 1.10, 2.15, and 2.42 N/mm2 for PMMA, PC, PS, nylon, and Al substrates, respectively. Furthermore, obtained adhesive indicated greater tendency to polar substrates in comparison to nonpolar ones by the factor of 16–95%. Obtained results suggested a new photo‐curable adhesive with privileged features, which has capability to be used in high temperature applications.