Abstract
A wirebonding technique is presented for designing a single-layer miniature and broadband microstrip antenna on the basis of experiments. The technique most commonly applied in device assembly will support manufacturing and packaging of small antennas by avoiding via-holes. Consisting of three short-circuited elements fed by a parasitic wirebonding configuration, the antenna in a package format has the merits of wide impedance bandwidth, miniature structure, flexible matching and easy integration into RF front-end units. Its stable and broadside copolarised radiation patterns in the frequency range of 2.40-2.51 GHz are satisfactory for Bluetooth application.
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