Abstract
In this work, the issue of limited bandwidth typical of microstrip antennas realized on a single thin substrate is addressed. A simple yet effective design approach is proposed based on the combination of traditional single-resonance patch geometries. Two novel shaped microstrip patch antenna elements with an inset feed are presented. Despite being printed on a single-layer substrate with reduced thickness, both radiators are characterized by a broadband behavior. The antennas are prototyped with a low-cost and fast manufacturing process, and measured results validate the simulations. State-of-the-art performance is obtained when compared to the existing literature, with measured fractional bandwidths of 3.71% and 6.12% around 10 GHz on a 0.508-mm-thick Teflon-based substrate. The small feeding line width could be an appealing feature whenever such radiating elements are to be used in array configurations.
Highlights
Microstrip patch antennas have been widely used in the past years thanks to key features, such as low profile, light weight, ease of integration with planar circuits, and low-cost manufacturing [1]
Many approaches have been introduced in recent books [2,3,4,5,6] and articles to extend the bandwidth of a microstrip patch antenna up to 50% and more, this always comes as a trade-off, either in gain, polarization, or complexity of the antenna configuration
Two configurations of line-fed broadband microstrip patch antennas printed on a single-layer thin dielectric substrate have been presented
Summary
Microstrip patch antennas have been widely used in the past years thanks to key features, such as low profile, light weight, ease of integration with planar circuits, and low-cost manufacturing [1] Such advantages become relevant when several patches are arranged in an array configuration to realize high gain antennas with properly shaped radiation patterns. There is a vast literature on broadband patch antennas: some techniques include two-layer proximity-coupled patches [7,8], aperture-coupled patches [9,10], and stacked patches [11,12,13] These solutions increase the manufacturing complexity and cost, as all of them require multilayer substrates.
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