Abstract
Experiment on ablation of silicon wafer on different crystallographic facet planes by single laser pulse irradiation was carried out with a femtosecond pulsed laser operating at a wavelength of 780 nm and a pulse width of 160 fs. The quality and morphology of the laser ablated silicon surface were evaluated by atomic force microscopy. The ablation threshold fluences on different crystallographic facet planes were obtained through the relationship between the squared diameter of the craters and pulse energy. The effects of different crystallographic facet planes of silicon wafer on the process of femtosecond laser ablation of silicon wafer were studied.
Sign-in/Register to access full text options 
Free) 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a call
