Single diamond scribing of SiCf/SiC composite: Force and material removal mechanism study

Abstract

SiC fiber-reinforced SiC ceramic matrix (SiCf/SiC) is an advanced high-temperature material widely used in the heat-resistant componets of the aerospace engine and nuclear reactor, which are generally precisely ground to achieve the designed dimensional and geometrical tolerances. This research investigates the scribing force and material removal mechanism of 2.5D woven SiCf/SiC with the flat and sharp diamond grits, which present the new dressed and worn grinding wheel. The results show that the sharp grit has larger wear on the cutting edge and generates lower force than that of the flat grit at the same scribing depth and groove cross-section area. In both sharp and flat grits, the SiC matrix is mainly removed by the fracture cracks, peeling off, fiber exposure and powdering. In transverse diamond scribing of the SiCf, the fiber debonding and shear breakage are dominant removal feature for the flat grit scribing. Two additional removal patterns, the ductile scratch and fiber cracking, are observed for the sharp grit. In parallel diamond scribing of the SiCf, the shear and bending fractures in the cut-in and cut-out points are two key material removal modes, respectively, especially in the fiber woven structure. This research provides a fundamental understanding of interaction force and the material removal process of SiCf/SiC in grinding.