Abstract
AbstractThe focus of this paper is to investigate the synergistic influence of contact loads, surface stress state and chemical environment on material removal during mechanical stimulation of copper surface. A unique setup is used to generate well characterized stress states on a polished copper specimen. Stressed surface of copper specimen is stimulated using tip of the atomic force microscope (AFM) and material removed during stimulation is measured as a function of contact loads, surface stress state and chemical environment. Measured material removal rates display a complex dependence on contact pressures and in-plane stress state which changes as the pH of chemical environment changes from acidic to basic. A surface material removal mechanism based on a single asperity wear and stress-assisted dissolution is proposed to explain the experimental observations
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