Abstract
Polymer composites with enhanced thermal and dielectric properties can be widely used in electric and energy related applications. In this work, epoxy composites have been prepared with Ti3C2Tx, one of the most studied MXene materials that can be massively produced by direct etching using hydrofluoric acid. The addition of conductive two dimensional Ti3C2Tx platelet fillers leads to improved but anisotropic thermal conductivity of the composites. The through-plane thermal conductivity reaches 0.583 Wm−1K−1 and the in-plane thermal conductivity reaches 1.29 Wm−1K−1 when filler content is 40 wt% (21.3 vol%), achieving enhancements of 2.92 times and 10.65 times respectively, as compared with epoxy matrix. The dielectric permittivity of epoxy composite is enhanced by a factor of ~2.25 with 40 wt% fillers, and the dielectric losses are within a small value of 0.02. The results prove the effectiveness of Ti3C2Tx in simultaneously improving thermal and dielectric performance of epoxy composites, and it is deduced that further improvements may be obtained by using Ti3C2Tx nanoflake fillers.
Highlights
Polymer composites with substantially improved thermal conductivity (k) [1,2,3] and dielectric permittivity (ε) [4] are in great need for many applications, such as thermal interface materials [5,6], heat dissipation and thermal management [7,8,9], microelectronics, and energy storage related applications [4,10,11,12]
Epoxy composites were fabricated by using hydrofluoric acid (HF)-Ti3 C2 Tx micro-platelet fillers, In epoxy composites were fabricated by by using
Both thermal and dielectric performance were improved by the addition of HF-Ti3 C2 Tx fillers
Summary
Polymer composites with substantially improved thermal conductivity (k) [1,2,3] and dielectric permittivity (ε) [4] are in great need for many applications, such as thermal interface materials [5,6], heat dissipation and thermal management [7,8,9], microelectronics, and energy storage related applications [4,10,11,12]. Appropriate fillers with inherent high performance are essential for preparing these desired functional polymer composites. These days, a new class of two dimensional (2D). Ti3 C2 Tx is expected to be an ideal filler for preparing polymer composites with enhanced thermal and dielectric properties. The laminated structure of Ti3 C2 Tx means large aspect ratio, which may result in high thermal conductivity [24] and good dielectric permittivity [4] by percolation. Using Ti3 C2 Tx as fillers may achieve a synergistic effect between the improved thermal and dielectric performance of polymer composites, potentially highly beneficial to the dielectric materials, because they always face the problem of the temperature rise caused by dielectric loss, which may eventually lead to material breakdown if the heat is not effectively dissipated. The thermal and dielectric performance of the HF-Ti3 C2 Tx /epoxy composites were analyzed and correlated with their structure and morphologies
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