Abstract
In sub 10-nm technology nodes, the directed self-assembly technology with multiple patterning lithography (DSA-MP) is a promising solution for contact/via layer fabrication. However, previous studies using multiple patterning with a single block copolymer (BCP) material still suffer from low via manufacturability due to limited types of feasible guiding templates. To mitigate the problem, multiple patterning in combination with two different BCP materials has been proposed, which contributes to more flexible DSA-compatible pattern matching. In this paper, we propose the first work of simultaneous guiding template assignment and layout decomposition with multiple BCP materials for general via layouts in DSA-MP. An optimal integer linear programming (ILP) formulation and a practical and sophisticated heuristic algorithm are proposed. Experimental results indicate that adopting two different BCP materials can greatly reduce conflict numbers compared with existing works using a single BCP material, and the proposed heuristic method can efficiently obtain good solutions.
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