Abstract
With the growth of 3D packaging technology and the development of flexible, transparent electrodes, the use of multilayer thin-films is steadily increasing throughout high-tech industries including semiconductor, flat panel display, and solar photovoltaic industries. Also, this in turn leads to an increase in industrial demands for inspection of internal analysis. However, there still remain many technical limitations to overcome for measurement of the internal structure of the specimen without damage. In this paper, we propose an innovative optical inspection technique for simultaneous measurements of the surface and film thickness corresponding to each layer of multilayer film structures by computing the phase and reflectance over a wide range of wavelengths. For verification of our proposed method, the sample specimen of multilayer films was fabricated via photolithography process, and the surface profile and film thickness of each layer were measured by two different techniques of a stylus profilometer and an ellipsometer, respectively. Comparison results shows that our proposed technique enables simultaneous measurements of the top surface and its underlying film surfaces with high precision, which could not be measured by conventional non-destructive methods.
Highlights
Multilayer circuits consisted of a stack of transparent conductive thin-film layers have been widely applied as the core and high-tech components throughout entire industries including semiconductor, flat panel display, and LED industries
In an attempt to overcome the technical limitations of existing conventional methods, we describe a Linnik interferometric configuration based on spectrally-resolved white-light interferometry
The calculation time taken for simultaneous measurement of surface profile and film thickness at a single point is worked out approximately 1 second when executing scripts written in MATLAB using a standard PC equipped with an INTEL core i7-4790 3.6 Hz Processor
Summary
Multilayer circuits consisted of a stack of transparent conductive thin-film layers have been widely applied as the core and high-tech components throughout entire industries including semiconductor, flat panel display, and LED industries. An organic luminescent electronic display (OLED) with multilayer transparent electrodes has emerged as the new generation display technique to provide superior mechanical flexibility, electrical conductivity, and optical transparency It requires field inspection solutions in order to improve productivity. In an attempt to overcome the technical limitations of existing conventional methods, we describe a Linnik interferometric configuration based on spectrally-resolved white-light interferometry This proposed technique enables accurate measurements of the phase and reflectance over a large range of wavelengths and these spectral interference signals are used to achieve volumetric inspection of complex multilayer film structure
Sign-in/Register to view highlights & summary Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
