Abstract
We have succeeded in growing multiwall carbon nanotubes (MWNTs) with low-resistance ohmic contacts to titanium electrodes by hot-filament chemical vapor deposition (HF-CVD) using a nickel catalyst layer on a titanium electrode. The contact resistance of the sample with nickel/titanium electrodes was two orders of magnitude smaller than that of the sample with nickel catalyst electrodes without titanium. We assumed that the low-resistance ohmic contact was achieved by forming titanium carbide (TiC) during the growth at the MWNT/titanium electrode interface. Moreover, we have demonstrated the growth of vertically aligned bundles of MWNTs, which were end-bonded to the lower titanium electrodes, selectively in via holes. We believe this is the first report of such simultaneous formation of MWNTs and their end-bonded low-resistance ohmic contacts, and its first trial application to carbon nanotube (CNT) vias for future ULSI interconnects.
Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
