Abstract
In this paper, the model of BGA solder joints were established by the finite element method (FEM). It would reflect the variations of creep stain in solder joints more truly by the cyclic temperature loading. The results are as follows: when the BGA solder joints subjected to cyclic thermal loading, the equivalent creep strain move to the center of solder joints gradually with the increase of the cycle times. With the increasing of peak temperature to the temperature cycling load, the life of solder joints decrease. The different heating rates had a little effect on the creep of the solder joints. While the heating rate was large, the time required for a single temperature cycle reduced. In the meantime, the total equivalent creep strain in the solder joints would reach the critical value of failure more faster. The accumulation of creep stain in solder joints increase more significant in the process of heating and cooling, and the increase amplitude wasn't obviously both of high and low temperature.
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