Simulation study of thermomechanical fatigue of quilt packaging interchip interconnects

Abstract

Quilt Packaging QP is a new direct interchip interconnect through metal nodules on chip edges We have performed simulations to study the robustness of QP against fatigue failure For quilts on ceramic carriers thermal stresses are driven primarily by the adhesive between chip and carrier and we have simulated systems with different adhesives as well as different chip material combinations Simulations for the test system estimated cycles to failure over a temperature range of to C The simulation results suggest favorable material properties for solder and adhesive to use for QP or QP like interconnects