Abstract
In order to simulate the thermal influence on springback property of O-ring, based on elastic-plastic contact analysis method of finite element analysis (FEA), numerical simulation of compression-springback course of O-ring was carried out by ANSYS software. The results show that it causes a sharp decrease in the peak force applied on O-ring, corresponding to a decline on the contact stress distribution which may influence the seal ability of the O-ring. The simulation results are in good agreement with the experimental results.
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