SIMULATION ON THE GROUND WAFER SHAPE IN WAFER ROTATIONAL GRINDING

Abstract

During the wafer rotational grinding, the wafer is located on a porous ceramic vacuum chuck, so there are many factors that can affect the wafer shape in the process of the wafer grinding. The wafer shape has an important influence on the surface quality of the silicon wafer and it will be greatly different if the processing parameters are different. So in this paper, based on a mathematics model of the ground wafer shape which has been developed, a simulation system of the wafer shape was made out by using Visual C++ and OpenGL. The relationship between the parameters and the wafer shape was researched and analyzed. The simulation results showed that the roll angle and the pitch angle had the greatest impact on the wafer shape. And the simulation results with different parameters have been compared with each other for the final conclusions. So the results demonstrate the mathematics model is reasonable and the simulation system is of high simulating accuracy, and the ground wafer shape can be predicted very well by it. The research results are significant to logically choose the wafer grinding parameters and effectively control the ground wafer shape.