Simulation of vacuum arc cathode spot movement between transverse magnetic field contacts

Abstract

Vacuum switches have been extensively used in the field of medium voltage. Carrying out relevant research on vacuum arc is particularly important for improving the performance and reliability of vacuum switches. The vacuum arc cathode spots provide metal vapor and electrons, which determine the breaking capacity of the vacuum switches to some extent. Therefore, based on the simulation model of the cathode spots between the transverse magnetic field (TMF) contacts, the motion phenomenon and distribution of the cathode spot were simulated and the characteristics of the initial diffusion stage of cathode spots between TMF contacts were studied. The simulation results showed that the probability of generating a cathode spot in the direction of retrograde motion increased with the increase in the TMF component and the direction of motion varied with the angle between the magnetic field and the contact. The diffusion process of cathode spots under wan-shaped contacts, cup-shaped contacts, and spiral-shaped contacts was simulated. The ring-shaped distribution of the cathode spots between cup-shaped contacts with a large current in the initial diffusion stage was formed by the self-generated magnetic field of cathode spots, while the axial magnetic field component and the clustered cathode spots destroyed the ring-shaped distribution. Taking the distribution of cathode spots and current from experiments as initial conditions, the simulation results of cathode spot distribution in the initial diffusion stage and the arc root radius were consistent with the experimental results.