Abstract
A large proportion of research on soldered joints focuses on the effects of stress on the service life of a solder joint. However, the shape of a joint also has a great effect on its service life. During the reflow process, the solder joint experiences heating, melting, cooling and then solidification. Conventionally, the shape of a solder joint is often predicted using the energy method after the reflow process. This, however, does not consider the evolution of the solder alloy during reflow. In this study, a computer aided analytical system is developed based on computational heat transfer and fluid dynamics techniques to simulate the shape evolution of solder joints during reflow. Experimental observations of the shape evolution of the joint during reflow were also conducted. The simulation results obtained for a solder ball 760 μm in diameter on a rectangular pad were found to be consistent with the experimental observations.
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