Simulation of Resistivity in Silver and Copper Nanowire Composite Filament using Composite Filament Simulation 3D to predict the Resistivity of the Nanowire

Abstract

Aim: The aim of this research work is to determine and compare the electrical resistivity of silver and copper nanowire by using the Novel Composite Filament Simulation Tool. Materials and Methods: This study was carried out at the Simulation laboratory, Saveetha School of Engineering, Chennai. The sample size calculation was done using clinical.com by keeping alpha error-threshold by 0.05, enrollment ratio as 0:1, 95% confidence interval, power at 80%. Group 1 was silver nanowire (N=20) and group 2 was copper nanowire (N=20). The total sample size was 40. Results: Comparison of electrical resistivity is done by independent sample test using SPSS software. There is a statistical indifference between silver and copper nanowire. Copper nanowire (55%) showed higher resistivity in comparison to silver nanowire (45%). There appears to be a statistically insignificant difference (p=0.269, p>0.05) by using an independent sample T test. Conclusion: Silver nanowire appears to give better electrical conductivity than in copper nanowire.