Abstract

Tunneling voltage of a nano-scale flash memory cell needs to be lowered considerably. This can be done only by employing very thin tunnel dielectrics. Quantum dot floating gate devices have shown a potential to do so in sub-65 nm regime. In this work, conventional and quantum dots' FGMOS gate stacks for 65 nm and 45 nm technology nodes are simulated in Synopsys TCAD. The experiments are simulated for metal control gate structures with ultra-thin oxides with 3.3 nm and 2.5 nm thicknesses. Quantum dots arrangement is optimized to give similar results as that of a conventional structure. The devices exhibit significant memory windows with tunneling voltages as small as 12 V and 6 V, respectively, with quantum dot devices further requiring lesser tunneling times.

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