Simulation of Nanofluid Flow in a Micro-Heat Sink With Corrugated Walls Considering the Effect of Nanoparticle Diameter on Heat Sink Efficiency

Yacine Khetib,Mohsen Sharifpur,Abdullah K Alanazi,Hala M Abo-Dief,Goshtasp Cheraghian,S Mohammad Sajadi

doi:10.3389/fenrg.2021.769374

Abstract

In this numerical work, the cooling performance of water–Al2O3 nanofluid (NF) in a novel microchannel heat sink with wavy walls (WMH-S) is investigated. The focus of this article is on the effect of NP diameter on the cooling efficiency of the heat sink. The heat sink has four inlets and four outlets, and it receives a constant heat flux from the bottom. CATIA and CAMSOL software were used to design the model and simulate the NF flow and heat transfer, respectively. The effects of the Reynolds number (Re) and volume percentage of nanoparticles (Fi) on the outcomes are investigated. One of the most significant results of this work was the reduction in the maximum and average temperatures of the H-S by increasing both the Re and Fi. In addition, the lowest Tmax and pumping power belong to the state of low NP diameter and higher Fi. The addition of nanoparticles reduces the heat sink maximum temperature by 3.8 and 2.5% at the Reynolds numbers of 300 and 1800, respectively. Furthermore, the highest figure of merit (FOM) was approximately 1.25, which occurred at Re=1800 and Fi = 5%. Eventually, it was revealed that the best performance of the WMH-S was observed in the case of Re=807.87, volume percentage of 0.0437%, and NP diameter of 20 nm.

Highlights

Advances in technology and electronic devices have posed a formidable challenge for related industries
At low velocities of the fluid, it can be seen that the fluid heated up at the beginning of WMH-S and had a low heat transfer in the end
As the fluid velocity increased, the fluid with lower temperatures moved inside the WMH-S, and as a result, cooling in the end of the WMH-S increased

Summary

Introduction

Advances in technology and electronic devices have posed a formidable challenge for related industries. Increasing the power of electronic devices in many cases causes them to heat up; in some cases it reduces the performance of the devices and, in certain circumstances, causes the electronic devices to fail. It is of absolute necessity to cool this equipment properly. The application of electronic equipment in devices such as cellphones and tablets in a small space has caused heat transfer to occur in a tiny space. CPUs are one of these electronic devices and cooling them is required in all of the abovementioned devices. As their computing power enhances, the generated

Methods

Results

Conclusion