Abstract
Abstract: In recent time, due to exponential growth in electronic devices there is significant increase in heat dissipating element like integrated circuits(IC), graphical 2Assistant Professor, processing units (GPU) and central processing units (CPU). If there is no proper arrangement for heat removal it can permanently damage whole system. There are several methods used for this, one of which is thermoelectric cooling which works on peltier effect, thermoelectric devices with proper cooling arrangement act like heat pump which removes heat from one side and provide it to another side. The drawback of this system is low efficiency. In this project CFD analysis is done for minichannels of different dimensions along with thermoelectric. Simulation is performed by changing parameters such as hydraulic diameter of minichannel, changing type of heat transfer fluid and mass flow rate of fluid. The study reveals that by optimizing these parameters performance of thermoelectric system can be improved. The aim of this study is to optimize these parameters in order to improve overall heat transfer coefficient and coefficient of performance of the system. Keywords: Thermoelectric cooling, Peltier effect, Minichannel, Overall heat transfer, CFD
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