Abstract

Fast and accurate prediction of hot lumens of LEDs installed in luminaires is an important step in the design of robust and reliable products. A possible approach to this is to create a multi-domain circuit model of a complete LED chip+package+luminaire system that can be simulated by any Spice-like circuit simulator with electro-thermal capabilities. Many LED chip and LED package models and modeling techniques have been published recently, but compact thermal modeling of luminaires as multi heat-source system was not yet dealt with in the literature. This paper aims to fill this gap be describing a systematic approach for system (luminaire) level analysis aimed at solving the combined thermal, electrical and light output simulation problem consistently by describing a method for creating a compact thermal model of LED luminaries with an approach borrowed from the layout based electro-thermal simulation of analog ICs. The applicability of the described method is demonstrated with a real life example, including the validation of the results with thermal measurements.

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