Abstract
Simulation results of InAlAs/InGaAs High Electron Mobility Transistors based on both GaAs and InP substrates are presented using the two-dimensional device simulator MINIMOS-NT. Three different HEMT technologies are evaluated by simulation and a single set of physical parameters is verified. The critical interaction of self-heating, impact ionization, SiN surface effects, and material composition is incorporated, which renders the simulation results suitable for the evaluation of device reliability issues. Starting from the analysis of gate-currents the simulation model can quantitatively support the basic understanding of this advanced material system.
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