Abstract
In recent decades peoples are moving towards high power density and smaller package size especially in electronic systems. This demands an effective cooling mechanism in order to prevent the electronics components from overheating. The CFD analysis is carried out on the performance of different pin fin heat sink in forced convection flow. In this paper, the overall performance of heat sink is designed and analysis for different parameters like the dimensions of the pin fin, fin density, longitudinal and transverse spacing and size of the heat sources, heat sink material, velocity and arrangement of pinfins. Finally the results are compared with the Computational Fluid Dynamics (CFD) software STARCCM+. The results from STARCCM+ software are in close arrangement with theoretical solutions.
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