Abstract

In this article, alumina/water nanofluid (NF) flow in a heatsink (H-S) with wavy microchannels (W-MCs) is simulated. The H-S is made of aluminum containing four similar parts. Each part has an inlet and outlet. Constant heat flux is applied on the bottom of the H-S. The study is based on two-phase (T-P) mixture and single-phase (S-P) models to determine the difference between these two types of simulations. FLUENT software and the control volume method were used for simulations. The volume control method is employed to solve equations. The effective variables include the volume fraction 0 < φ < 5% of alumina and Reynolds number (Re) 300 < Re < 1800. The maximum H-S bottom temperature, the required amount of pumping power (PP), the temperature uniformity, and the heat resistance of the H-S are the outputs studied to simulate the S-P and T-P models. The results show that the use of the T-P model has less error in comparison with the experimental data than the S-P model. An increment in the Re and φ reduces the maximum temperature (M-T) of the H-S. The S-P model, especially at a higher value of φ, leads to a lower M-T value than the T-P model. The S-P model shows a 0.5% greater decrease than the T-P model at the Reynolds number of 300 by enhancing the volume percentage of nanoparticles (NPs) from 1 to 5%. Temperature uniformity is improved with Re and φ. The reduction of H-S thermal resistance with Re and φ is the result of this study. Adding NPs to water, especially at higher amounts of φ, enhances the required PP. The T-P model predicts higher PP than the S-P one, especially at a high value of φ. The T-P model shows 4% more PP than the S-P model at Re = 30 and a volume fraction of 4%.

Highlights

  • Heatsinks (H-Ss) are widely used in various industries such as electronics and electrical industries, solar industries, military industries, aerospace, etc

  • It is necessary to measure the error of both S-P and T-P models with a valid reference to determine which method is more accurate with respect to the experimental data

  • It is generally seen that the amount of simulation error at lower amounts of Reynolds number (Re) is lower for both models than for high values of Re

Read more

Summary

Introduction

Heatsinks (H-Ss) are widely used in various industries such as electronics and electrical industries, solar industries, military industries, aerospace, etc. The H-Ss play a pivotal role, and many researchers have studied their performance (SohelMurshed and Nieto de Castro, 2017; Zhao et al, 2019; Qi et al, 2020a; Cheng et al, 2021; Pordanjani et al, 2021; Tian et al, 2021) The purpose of these studies has been to enhance the thermal efficiency of the H-S and reduce the temperature of the electronic components on which the H-S is installed. Kalbasi (2021) introduced a new H-S using phase-change material (PCM) and air-adopted with electrical equipment He used the characteristics of PCM and air to remove heat and keep the temperature of the electronic device low

Objectives
Methods
Results
Conclusion
Full Text
Published version (Free)

Talk to us

Join us for a 30 min session where you can share your feedback and ask us any queries you have

Schedule a call