Abstract
Nowadays, the demand for a MEMS Development/Design Kit (MDK) is even more in the focus than ever. In order to achieve a high quality and cost effectiveness in automotive and consumer applications, an advanced design flow for the MEMS (Micro Electro Mechanical Systems) element is required to fulfill these criteria. In this paper, a methodology and design flow is presented to ensure an integration of active semiconductor devices and components into micromechanical sensors. The methodology considers cross coupling effects and limitations of the electrical active device and mechanical MEMS. An example with mechanical constraints is presented and discussed and finally the results of the simulation methodology are compared with fabricated devices in terms of accuracy and capability of the design flow.
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