Abstract
This paper aims to provide a design approach to predict the attenuation of microstrip transmission lines fabricated by Laser Direct Structuring (LDS) on LDS polymer substrates. The impact of conductor and dielectric losses are separately considered in full wave simulation to evaluate the order of corresponding contribution to the total attenuation. Impact of surface roughness on signal propagation is taken into account by the Gradient Model. Simulations are compared with measurements of fabricated microstrip lines. The result also gives an estimation on the applicability of the LDS process towards radio frequency components.
Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
