Simulation and performance of passive microwave and millimeter wave coplanar waveguide circuit devices with flip chip packaging

Abstract

This paper presents a descriptive study of the design and modeling of grounded coplanar waveguide (GCPW) and finite ground coplanar waveguide (FGCPW) circuits for microwave and millimeter wave applications. It is demonstrated that FGCPWs have a number of advantages over GCPW and microstrip, including that it easily accommodates flip chip packaging. It is also demonstrated that full-wave electromagnetic analysis tools can be used effectively to reduce the design cycle time of practical microwave circuit devices.