Abstract

The objective of this work is to make a thermal study beginning with the simulation and implementation of the equation of thermal convection in a complex system design through numerical simulation. This simulation is based on the code of the numerical calculation by finite element module CFD that will allow us to model a variety of physical phenomena characterizing a real problem as the heat exchange by convection. The proposed governing equations are based on the Newton law of conduction and heat convection. The temperature profile in the convection is obtained from the simulation analysis using the COMSOL tool to ensure a uniform temperature distribution in both natural and forced convection. In general, in order to obtain the temperature differences between the two types of convection and also to demonstrate the capability of a type with respect to the other, it is necessary to validate this equation of convection which consequently helps verify the dissipated power of 0.6 W for a surface of 4.68 mm×5.97 mm. The power is uniformly divided in the volume of the ASIC. The DBC (Dirichlet Boundary conditions) method is applied around the ASIC at 25°C. Through these simulations, the relationship between the powers dissipated by ASIC and the difference of temperature in both forced and natural convection will be validated to implementation on FPGA using VHDL code to monitor and verify the power dissipated 0.6 W a surface ASIC circuit.

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