Abstract
In this paper, warpage experiment was carried out on electronic module in heating process by the digital image correlation. As a widespread used measurement in recent years, digital image correlation technology was used in the electronic packaging for measuring warpage and its strain. DIC includes two key steps: camera calibration and image matching. The camera calibration involves a pinhole model approach. It employs feature-matching-based initial guess, multiple subsets, iterative optimization algorithm, and reliability-guided computation path to achieve fast and accurate image matching. Image matching process was calculated by software Vic-3D. Simulation have been conducted to verify the experimental results by Abaqus. By comparing the results of experiment and simulation, the measurement results for chip's warpage are correct.
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