Abstract
The paper is devoted to simulating the impact of a thermal shock on a thin homogeneous plate in the ANSYS package. The assessment of the stress–strain state is carried out and the dynamics of changes in the temperature field of the plate is determined. The obtained results were compared with the data of other authors and can be used when taking into account the thermal shock of large elastic elements of spacecraft.
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
More From: International Journal of Modeling, Simulation, and Scientific Computing
Disclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.