Abstract
This study introduces a less complex approach for modelling the power PIN diode in MATLAB/SIMULINK software. In this approach, a behaviour modelling methodology is adapted to explore the distributed effect of both the electrical and thermal phenomena within the component. The manufacturer's data are the main source of information. Indeed, all of the modelling parameters are derived from the published data sheets. Moreover, the model validation is obtained by a comparison between the simulation results and the datasheet characteristics given for several tests. The diode model presented in this study is validated from an electro-thermal point of view.
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