Abstract
AbstractA simplified procedure has been developed to optimize the molding processes of thermosetting resins. The proposed methodology involves the classical finite element commercial package (NISA II v. 17). Here, the theoretical background and numerical implementation of the procedure are described. Various design variables that can describe the RIM are discussed. The solved example represents the influence of the heating regime on the curing process. The results are compared with the results obtained with the use of full analysis conducted with the aid of the finite volume analysis (filling and curing stages). They demonstrate the evident advantages of using the simplified optimization approach.
Highlights
Using the governing equations presented in the Appendix the heat conduction process of resin materials curing can be written in the following way: model allows for determining the rate of curing reaction depending on the degree of cure a as follows: dα dt
Where a is the degree of cure, and Hr is the total amount of heat generated during a complete resin reaction
The cited authors mentioned that the form of the curves plotted in Figure 2 was strongly affected by the heating rates
Summary
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