Abstract
A breakthrough of a new thick-film thermal printing head has been studied by developing a simplified structure of the heating elements, and unique processing techniques. The fabrication process of the heating resistors is quite simple; they are formed in a belt shape (a single line with 0.25 mm width) by using a dispensing technique of thick-film resistor paste, and no resistor geometrically separated even if the resolution attained is 200 dots/inch. A resistance value between each I/O (input/output) terminal and a common terminal was equalised by adding a compensating resistor formed between the first and the common terminal, and also formed between the last and common terminal. Furthermore, to reduce thermal cross-talk generated in the adjacent resistors, an isolating resistor between heating resistors has been employed. The resistance value of the isolating and compensating resistor was effectively determined through resistor network analysis to prevent both thermal cross-talk and thermal smearing caused by substrate heating. Through this study, an advanced thermal printing head having a 32-dot heating element with 200 dots/inch has been developed with excellent printing quality and low power consumption (0.4 mJ/dot). Also, the printing life was satisfactorily long-term.
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Disclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.