Abstract

A simple method for the determination of a Si p+/n junction depth is presented. The method is designed to delineate the specific junction due to its importance in the field of Si solar cells where cost effective and fast characterization techniques are necessary. It consists of the electrochemical transformation of the p+ Si to porous Si. The determination of the porous Si depth with the use of cross-sectional Scanning Electron Microscope (SEM) images provides a direct, fast and easy to implement measurement of the junction depth. In addition, through a simple 4-point probe electrical measurement of the sheet resistance, the average dopant concentration is determined, which allows the creation of an abrupt junction approximation of the p+/n junction. The method is shown to produce accurate results in two types of doping techniques, namely implantation and spin-on-doping and a range of junction depths between 200 nm and 1500 nm, as compared to the well-established secondary ion mass spectrometry (SIMS) technique.

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