Simple geometrical model of thermal conductivity and bound-water diffusion coefficient in resin-rich regions of softwood plywood

Abstract

In this study, a geometrical model for wood cells and penetrated adhesive resin at the veneer–veneer interface of plywood was developed. On the basis of this model, equations of thermal conductivity and a bound-water diffusion coefficient for resin-rich regions of softwood plywood were theoretically determined. These equations are suitable for use in numerical simulations of unsteady-state nonisothermal moisture diffusion. By introducing them into an existing coupled heat and moisture transfer model, a simple and physically reasonable simulation of moisture transfer through softwood plywood can be achieved.