Abstract
In our work, using correlation analysis, we attempted to determine the effect of prior phosphorylation of the substrate with various organophosphorus compounds (OPC) of different nature on the degree of modification of the substrate with organosilicon compounds (OSC). We also tried to determine the dependence of silicon content in % by mass on the temperature and time of modification using the single-factor analysis of variance. It has been established that the pre-phosphorylation of the substrate increases the degree of its modification by the studied OSC. It is most likely due to the fact that polar OPC molecules, which have better penetrating and fixing abilities in the substrate, act as “conductors” of OSC into the substrate structure. The most effective “conductor” of OSC into the substrate, depending on modification time, can be considered tricresylphosphate (TCP) at a modification temperature of 20 degrees, because under these conditions, the correlation coefficients of OSC are higher than for other conditions of OPC processing. Dimethylphosphite (DMP) can be considered the most effective “conductor” of OSC into the substrate depending on the modification temperature because the correlation coefficients for all OSC are higher under these conditions than under other OPC processing conditions. It was found that there was a strong, direct correlation between the time of modification and the percentage of silicon content in the cellulose. The variation in the values of the calculated correlation coefficients ranged from 0.8927 to 0.9827. However, the direct correlation between the modification temperature and silicon content in cellulose in % was stronger and the scatter of correlation coefficients ranged from 0.9719 to 1.
Published Version
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