Silver/Diamond Composite Material - Powder Metallurgical Route and Thermo-Physical Properties

Abstract

To meet the need of high-performance thermal management materials in the field of electronic applications, heat sink materials reinforced with synthetic diamonds have been prepared via powder metallurgy. A matrix of a silver alloy with a silicon content of 0.45 wt.% was chosen out of the prediction of the thickness of a final carbide layer of about 180 nm. The volume content of the diamonds and the diamond size were kept constant. The mixed powders were consolidated by Spark Plasma Sintering (SPS) using different sintering temperatures between 800 and 870 °C with a holding time of 30 min. The maximum thermal conductivity of 680 W/(mK) measured at room temperature and 620 W/(mK) at 275 °C was obtained at 810 °C sintering temperature. The degradation of the most promising sample after one thermal cycle up to 275 °C was determined below 1 percent of the value after sintering.