Abstract
ABSTRACTSilicone pressure‐sensitive adhesives compositions contain a polydimethylsiloxane and a silicone resin, which can enhance the instant bonding ability and bonding strength of the adhesive. In this study, silicone resin was designed to have a low molecular weight and a highly nonpolar chemical structure. The silicone resin was applied to silicone pressure‐sensitive adhesives. The molecular structure of silicone resin was characterized by FT‐IR, GPC, 1H‐NMR, and 29Si‐NMR spectroscopic techniques. Properties such as thermal stability, solubility, hydrophobic, and transparent properties were researched and compared. When the chlorotrimethylsilane increased, it appeared that the amount of silanol groups, molecular weight and thermal stability decreased, while the hydrophobic and transparent properties increased. The silicone resin was completely soluble in toluene and xylene. It was also applied to silicone pressure‐sensitive adhesives, resulting in good peel adhesion. © 2013 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 2014, 131, 40317.
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