Abstract

The effect of multiwall carbon nanotubes (MWCNTs) and magnesium oxide (MgO) on the thermal conductivity of MWCNTs and MgO-reinforced silicone rubber was studied. The increment of thermal conductivity was found to be linear with respect to increased loading of MgO. In order to improve the thermal transportation of phonons 0.3 wt % and 0.5 wt % of MWCNTs were added as filler to MgO-reinforced silicone rubber. The MWCNTs were functionalized by hydrogen peroxide (H2O2) to activate organic groups onto the surface of MWCNTs. These functional groups improved the compatibility and adhesion and act as bridging agents between MWCNTs and silicone elastomer, resulting in the formation of active conductive pathways between MgO and MWCNTs in the silicone elastomer. The surface functionalization was confirmed with XRD and FTIR spectroscopy. Raman spectroscopy confirms the pristine structure of MWCNTs after oxidation with H2O2. The thermal conductivity is improved to 1 W/m·K with the addition of 20 vol% with 0.5 wt % of MWCNTs, which is an ~8-fold increment in comparison to neat elastomer. Improved thermal conductive properties of MgO-MWCNTs elastomer composite will be a potential replacement for conventional thermal interface materials.

Highlights

  • Due to their light weight, high dimensional accuracy, and adequate properties, polymeric materials have gained significant importance in recent times

  • The thermal conductivity is linearly increased with the addition of magnesium oxide (MgO) nanoparticles

  • For improving the heat transfer in composites between the matrix and fillers, the highaspect-ratio multiwall carbon nanotubes (MWCNTs) were incorporated in the elastomer matrix after functionalization with H2 O2

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Summary

Introduction

Due to their light weight, high dimensional accuracy, and adequate properties, polymeric materials have gained significant importance in recent times. Use of polymeric materials has exponentially increased and polymers can extensively be used in fabrication of composite materials Due to their promising insulating qualities, good thermal stability, high strength, sufficient mechanical properties, biocompatibility, and simplicity in fabrication, elastomers are the second most widely used thermoset polymers after polyester [1,2,3,4,5,6,7,8,9]. Besides these properties, there are few properties like thermal conductivity that are quite low and do not meet the requirements of many applications. The miniaturizing in electronic components makes the heat dissipation problem more significant and drastic

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