Silicon-Based, Multi-Chip LED Package

Abstract

A new silicon based multi chip white LED PKG for high power application is designed, fabricated and tested. The package is composed of Al layer coated reflector cup, silicon base which has micro through via hole for interconnection, and micro lens. Compared to the most conventional single chip LED PKG, multi chip white LED PKG has many advantages in cost, density, size, thermal resistance and optical efficiency. After numerical analysis, silicon based multi chip LED PKG which has 9 mm times 9 mm with 0.65 mm size is fabricated using simple MEMS technology. The thermal resistance of this new silicon package was about 4-5 K/W from junction to case in simulation and this result could be comparable to that of other high power LED package. Also, this PKG platform has over than 60% increase in optical extraction efficiency. The proposed multi chip LED PKG can find applications, such as a next generation solid state lighting, back light units and etc.