Abstract
A silicon thermal flow-sensor system based on ceramic substrate is described in this paper. The sensor chip is mounted on a ceramic substrate with a metal heat sink. The simulation by ANSYS software and the experiment are done for determining suitable package size. The results from the ANSYS simulation and the standard flow test in the flow tunnel show that when the radius of the ceramic is 10mm and the heat conduction is35Wm-1K-1, the performance of the sensor is much better. The heat sink will make the flow-sensor more stable. The wind speed up to 35m/s and the precision of 0.5m/s are acquired in this experiment.
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