Abstract
Demolding force for thermal imprint process to polymethylmethacrylate (PMMA) film is examined by use of Si templates with various side wall profiles. Patterns with tapered side wall profile can be fabricated by control of etching conditions. Side wall profile can be smoothened by anisotropic etching by use of mixed solution of potassium hydroxide (KOH) solution and isopropyl-alcohol. It is confirmed that demolding force can be reduced when mold with tapered side wall pattern is used. Demolding force can be greatly reduced by KOH treatment. Especially, when the template with taper and smooth side wall patterns is used, demolding force is below our measurement system limit of 0.1 kgf. It is confirmed that the KOH treatment is very effective in order to reduce demolding force.
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