Abstract
• Slag refining was employed for Si recovery from Si saw waste because of θ SiC/ CaO–SiO2–MgO < θ SiC/Si . • The movement and dissolution behaviors of SiC were observed in situ and in real-time using HT-LSCM. • A prolonged slag refining time was conducive to increasing the SiC removal efficiency. Recycling Si from Si sawing waste is a good approach aiming at meeting the rapidly increasing demand for Si, and the separation of Si and SiC particles plays a key role in the production of high-quality Si. In this work, Si was successfully recovered from Si sawing waste by using a CaO–51mol%SiO 2 –15mol%MgO slag. This recovery included measurement of the contact angle between a CaO–SiO 2 –MgO slag and SiC using the sessile drop method. The results, θ SiC/SiO2–CaO–MgO < θ SiC/Si (i.e., 21.7° < 38°) at 1753 K, confirmed the feasibility of applying the slag refining technique to SiC particle removal. Furthermore, with the help of high-temperature laser-scanning confocal microscopy, the movement and dissolution behaviors of SiC were observed in situ and in real-time. A prolonged slag refining time provided sufficient time for SiC particle transfer across the Si/slag interface and dissolution in slag, thereby resulting in a high SiC particle-removal efficiency.
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