Silicon Photonics Technology Platform for integration of optical IOs with ASICs

Abstract

• We highlighted Silicon Photonics Technology Platform and its scalability to increased data rates, higher interconnect densities and low system level power dissipation. • Silicon photonics has been in production since 2009 and has shipped > 500K+ chipsets for use in High Performance Computing and Datacenters. • We made the trade-off between hybrid and monolithic integration of photonics and electronics. Hybrid Silicon Photonics allows cost effective integration of photonics with advanced electronic nodes. • By integrating 3rd Party IP in the electronic IC, hybrid integration enables a first level of ASIC integration with Photonics. • A next level of ASIC integration is enabled by a “Silicon Photonics Interposer” where photonic capabilities are combined with hybrid integration with electronics and TSV technology.