Abstract
We present recent results of a silicon photonic integrated chip that is capable of transmitting data at an aggregate rate of 200 Gb/s. It is based on wavelength division multiplexing where an array of eight high speed silicon optical modulators are monolithically integrated with a demultiplexer and a multiplexer. The modulators, each capable of 25 Gb/s data transmission, are based on the carrier depletion effect of pn diodes, and the demultiplexer/multiplexer is based on a cascaded asymmetric Mach Zehnder interferometer design.
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