Silicon oxide diffusion barrier coatings on polypropylene

Abstract

In this study the influence of process conditions for the plasma-enhanced chemical vapor deposition of SiO x diffusion barrier coatings on polypropylene (PP) is investigated and compared to results obtained on polyethylene terephthalate (PET). It was observed that the thermal load during deposition is much more crucial in the case of PP. If the thermal load is not the limiting factor, the composite parameter (CP) energy input per mass of precursor showed to be valuable to describe plasma conditions at constant oxygen to monomer ratio. Low oxygen transmission rates (OTRs) of 5.1 ± 3.6 and 0.3 ± 0.1 cm 3/m 2day/atm were achieved on PP and PET foil, respectively, for an optimal CP of 4.1 × 10 5 J/g. Fourier transform infrared (FTIR) spectroscopy revealed that low carbon and silanol content is necessary for good barrier performance. Low RF power, necessary to reduce thermal load on PP, can be compensated by increasing the oxygen to monomer ratio. For favorable plasma conditions, the dependence of the OTR on the coating thickness follows a similar trend for both substrate materials with a critical thickness of approximately 12 nm. The residual permeation can be correlated to the defect density at each stage of film growth by means of a simple correlation. Further support for permeation through defects is found by the activated rate theory, since the apparent activation energy of oxygen permeation is below typical values of amorphous glasses and remains unchanged due to the deposition of SiO x on both substrates.