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Abstract
We present a simple thin film encapsulation technique for organic light emitting devices (OLEDS), for use in flexible flat panel displays (FPDs). We systematically studied the moisture-resistant properties of silicon nitride thin films prepared by plasma-enhanced chemical vapor deposition (PECVD) and found that silicon nitride thin films have a low water vapor permeation (WVP) rate even deposited at low substrate temperature (20°C). Then OLEDs prototypes were successfully packaged by depositing silicon nitride thin films on them. Based on the analysis of the degradation of the OLEDs, we found the lifetime of the encapsulated devices was increased by more than two orders of magnitude over that of the unencapsulated ones. Our results demonstrated the feasibility of thin film packaging for OLEDs and the possibility to realize the flexible FPDs.
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