Abstract
The interface state density and the fixed charge were measured on metal/insulator/semiconductor (MIS) structures produced using plasma-enhanced chemical vapour deposited silicon nitride as insulator layer and Si, InGaAs and InGaAsP as semiconductors. The experimental results showed that the electrical characteristics of the interface depends on both the insulator stoichiometry, varied by changing the values of the insulator deposition parameters, and the physical conditions of the semiconductors surface. The plasma-induced damage in the surface layer of the compound semiconductors was found to be responsible of the U-shaped interface state density distributions, in agreement with the “surface disorder model” postulated for the GaAs and InP interfaces. The decrease of the density of states and the fixed charge, induced by a thermal annealing in nitrogen, is also shown and discussed.
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Disclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.